Amkor Technology | AMKR

Peers Price Chg Day Year Date
2330 Taiwan Semiconductor 782.00 16.00 2.09% 59.10% Apr/26
ACLS Axcelis Technologies 100.02 1.36 1.38% -15.24% Apr/25
AEIS Advanced Energy Industries 93.85 0.99 1.07% 11.77% Apr/25
AMAT Applied Materials 197.53 1.35 0.69% 79.07% Apr/25
AMKR Amkor Technology 30.08 0.24 0.80% 37.48% Apr/25
ASX Advanced Semiconductor Engineering 10.15 -0.22 -2.12% 49.05% Apr/25
BRKS Azenta 51.49 -0.58 -1.11% 26.36% Apr/25
COHU Cohu 30.87 0.51 1.68% -6.82% Apr/25
DQ Daqo New Energy 23.56 -0.19 -0.80% -44.34% Apr/25
ENPH Enphase Energy 107.85 0.65 0.61% -34.17% Apr/25
ENTG Entegris 128.53 0.66 0.52% 78.61% Apr/25
FORM FormFactor 43.90 2.18 5.23% 62.77% Apr/25
INTC Intel 35.12 0.65 1.89% 20.90% Apr/25
KLAC KLA-Tencor 673.29 16.27 2.48% 88.41% Apr/25
KLIC Kulicke And Soffa Industries 46.14 0.61 1.34% -2.02% Apr/25
LRCX Lam Research 903.26 15.99 1.81% 81.60% Apr/25
MKSI MKS Instruments 116.27 2.49 2.19% 44.26% Apr/25
NANO Onto Innovation 182.33 5.57 3.15% 131.09% Apr/25
OLED Universal Display 156.52 0.08 0.05% 17.60% Apr/25
PDFS PDF Solutions 30.19 0.11 0.37% -20.24% Apr/25
PLAB Photronics 27.75 0.24 0.87% 95.70% Apr/25
RMBS Rambus 58.11 1.59 2.81% 26.46% Apr/25
TSM Taiwan Semiconductor Mfg 136.62 3.88 2.92% 66.10% Apr/25
TXN Texas Instruments 174.31 0.41 0.23% 5.99% Apr/25
UCTT Ultra Clean 40.81 0.55 1.37% 43.39% Apr/25
VECO Veeco Instruments 34.37 0.48 1.42% 87.00% Apr/25

Indexes Price Day Year Date
CCMP USND 15612 -100.99 -0.64% 31.70% Apr/25
RTY US2000 1981 -14.31 -0.72% 13.13% Apr/26

Amkor Technology traded at $30.08 this Thursday April 25th, increasing $0.24 or 0.80 percent since the previous trading session. Looking back, over the last four weeks, Amkor Technology gained 4.69 percent. Over the last 12 months, its price rose by 37.48 percent. Looking ahead, we forecast Amkor Technology to be priced at 31.62 by the end of this quarter and at 29.85 in one year, according to Trading Economics global macro models projections and analysts expectations.

Amkor Technology, Inc. is a providers of outsourced semiconductor packaging and test services. The Company’s packaging and test services are designed to meet application and chip specific requirements, including the required type of interconnect technology; size; thickness; and electrical, mechanical and thermal performance. It provides turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, system-level and final test and drop shipment services. The semiconductor manufacturing process consists of Integrated circuit (IC) design, wafer fabrication, wafer probe, packaging and final test. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies, original equipment manufacturers (OEMs) and contract foundries. IDMs generally design, manufacture, package and test semiconductors in their own facilities.